Hydrogen Peroxide
Applications
Semiconductor/LCD
Used mainly in LCD, PCB etching and metal plating. Ultra-pure H2O2 is used in removal of photo resistance in semi-conductor and cleaning of wafer oxidation
Paper Pulp Bleaching
Plays a role of bleaching and deinking paper pulp.
Textile Bleaching Industry
Is highly oxidative but does not damage fiber. This property is used as a permanent bleaching agent of dying process of cotton, wool, silk, etc.
Chemical Industry
Is a replacement of Chlorine oxidative agent as a eco-friendly product and its applications expand.
Food/Medical Industry
Is used as a color controller in the milk industry, starch bleach agent and as a disinfectant in medical industry.
Environmental Remediation Chemical
Is used as a waterwaste treatment agent as it decreases BOD, COD, etc during waterwaste treatment and minimizes corrosion of treatment facility
Characteristics
Characteristics
• Hydrogen Peroxide is used as raw material in the synthesis of the following chemicals : - Inorganic peroxygen compounds such as sodium perborate, sodium percarbonate, zinc peroxide and calcium peroxide- Epoxy ester plasticizers such as epoxidized soybean oil- Organic peroxygen compounds such as benzoyl peroxide, MEKPO, lauroyl peroxide, and various peroxy carbonates - Amine oxides such as lauryl dimethylamine oxide
• Hydrogen Peroxide is used as a bleaching agent in the pulp & paper, textile and food industries.
• Hydrogen Peroxide is used as a wastewater treatment agent. It eliminates such pollutants as phenolics , cyanides , sulfur compounds from industrial waste water streams.
• Hydrogen Peroxide is used as an etching, cleaning, and oxidizing agent for metal and electronics such as PCB,semi-conductor and other industries.
• Hydrogen Peroxide is used as a sterilizer in the milk industry and as a disinfectant in medical treatment.
HYDROGEN PEROXIDE
Grade | Item | Unit | Spec. |
---|---|---|---|
32% | Assay Evaporation Residue Free Acid (as H2SO4) Stability |
wt% wt& wt% % |
32.0 Min. 0.100 Max. 0.050 Max. 98.5 Min. |
35% | Assay Evaporation Residue Free Acid (as H2SO4) Stability |
wt% wt& wt% % |
35.0 Min. 0.100 Max. 0.050 Max. 98.5 Min. |
50% | Assay Evaporation Residue Free Acid (as H2SO4) Stability |
wt% wt% wt% % |
50.0 Min. 0.100 Max. 0.050 Max. 98.5 Min. |
60% | Assay Evaporation Residue Free Acid (as H2SO4) Stability |
wt% wt& wt% % |
60.0 Min. 0.100 Max. 0.050 Max. 98.5 Min. |