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SUNWAY CORPORATION

Hydrogen Peroxide

Applications

Semiconductor/LCD

Used mainly in LCD, PCB etching and metal plating. Ultra-pure H2O2 is used in removal of photo resistance in semi-conductor and cleaning of wafer oxidation

Paper Pulp Bleaching

Plays a role of bleaching and deinking paper pulp.

Textile Bleaching Industry

Is highly oxidative but does not damage fiber. This property is used as a permanent bleaching agent of dying process of cotton, wool, silk, etc.

Chemical Industry

Is a replacement of Chlorine oxidative agent as a eco-friendly product and its applications expand.

Food/Medical Industry

Is used as a color controller in the milk industry, starch bleach agent and as a disinfectant in medical industry.

Environmental Remediation Chemical

Is used as a waterwaste treatment agent as it decreases BOD, COD, etc during waterwaste treatment and minimizes corrosion of treatment facility

Characteristics

Characteristics

• Hydrogen Peroxide is used as raw material in the synthesis of the following chemicals : - Inorganic peroxygen compounds such as sodium perborate, sodium percarbonate, zinc peroxide and calcium peroxide- Epoxy ester plasticizers such as epoxidized soybean oil- Organic peroxygen compounds such as benzoyl peroxide, MEKPO, lauroyl peroxide, and various peroxy carbonates - Amine oxides such as lauryl dimethylamine oxide


• Hydrogen Peroxide is used as a bleaching agent in the pulp & paper, textile and food industries.


• Hydrogen Peroxide is used as a wastewater treatment agent. It eliminates such pollutants as phenolics , cyanides , sulfur compounds from industrial waste water streams.


• Hydrogen Peroxide is used as an etching, cleaning, and oxidizing agent for metal and electronics such as PCB,semi-conductor and other industries.


• Hydrogen Peroxide is used as a sterilizer in the milk industry and as a disinfectant in medical treatment.

HYDROGEN PEROXIDE

Grade Item Unit Spec.
32% Assay
Evaporation Residue
Free Acid (as H2SO4)
Stability
wt%
wt&
wt%
%
32.0 Min.
0.100 Max.
0.050 Max.
98.5 Min.
35% Assay
Evaporation Residue
Free Acid (as H2SO4)
Stability
wt%
wt&
wt%
%
35.0 Min.
0.100 Max.
0.050 Max.
98.5 Min.
50% Assay
Evaporation Residue
Free Acid (as H2SO4)
Stability
wt%
wt%
wt%
%
50.0 Min.
0.100 Max.
0.050 Max.
98.5 Min.
60% Assay
Evaporation Residue
Free Acid (as H2SO4)
Stability
wt%
wt&
wt%
%
60.0 Min.
0.100 Max.
0.050 Max.
98.5 Min.